Qualcomm Brings Wi-Fi 7 and On-Device AI to Broadband Hardware 2026-06-04 The new MBM7 and MBM4 platforms add display, camera, and Hexagon-class AI inference to chips that previously only handled connectivity.
Vitesco uses Infineon’s CoolGaN transistors to boost power density in DC–DC converters 2024-12-31 DC–DC converters are essential in any electric or hybrid vehicle to connect the high-voltage battery to the low-voltage auxiliary circuits.
Infineon launches CoolGaN Transistors 650V G5 product family 2024-12-31 Infineon Technologies AG of Munich, Germany has strengthened its gallium nitride (GaN) portfolio by launching a new family of high-voltage discretes, the CoolGaN Transistors 650V G5.
IBM Demonstrates First ‘Multi-Processor’ for Quantum Processing 2024-12-30 IBM divided and parsed the quantum solution into two connected quantum processing units, demonstrating greater processing capability than either individual unit.
Toshiba ships early test samples of bare die 1200V SiC MOSFET 2024-12-30 Toshiba Electronic Devices & Storage Corp has developed new 1200V silicon carbide (SiC) MOSFETs with an innovative structure that delivers both low on-resistance (RDS(ON)) and high reliability.
Sensor Roundup: New ICs Redefine Precision, Safety, and Efficiency 2024-12-27 From elderly care facilities to brake pedal systems, these new sensor ICs rely on functionality and accuracy to keep modern monitoring systems up and running.
